-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
American Standard to Exhibit at DMC 2018 in Nashville
December 1, 2018 | American Standard CircuitsEstimated reading time: 1 minute
American Standard Circuits will be exhibiting at the Defense Manufacturing Conference (DMC) 2018, to be held December 3 – 6 at the Nashville Music City Center in Nashville, Tennessee.
“As one of the industry’s leading suppliers of defense and aerospace printed circuit boards, we feel that it is very important for us to be present at DMC 2018,” said CEO Anaya Vardya. “We welcome the opportunity to meet face to face with the country’s largest defense contractors with the intention of learning how we can better serve them. We look forward to meeting with both our customers and future customers at Booth 608.”
The DMC Conference's theme is "Manufacturing Innovation for the Warfighter." The show will be conducted simultaneously with the Diminishing Manufacturing Sources and Material Shortages (DMSMS) Conference. Attendees will be able to attend the concurrent DMSMS Conference at no additional expense, providing access to more technical information for the same travel cost.
About American Standard Circuits
American Standard Circuits (ASC) prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, RF/microwave, flex, and rigid-flex PCBs for the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide a wide variety of technologies in a time-critical environment. Their qualifications include AS9100 Rev D, ISO 9001:2015, MIL-PRF 31032, MIL-PRF-55110, MIL-PRF-50884 certification and ITAR registration. In addition to manufacturing in the USA, ASC can transition and manage your PCB requirements to lower cost regions via its qualified supply chain of offshore partners. ASC also holds many key patents for metal bonding processes. For more information about American Standard Circuits' services or to ask one of their technology experts a question, click here.
Visit I-007eBooks to download your copies of American Standard Circuits’ micro eBooks today:
The Printed Circuit Board Designer’s Guide… to Fundamentals of RF/ Microwave PCBs
The Printed Circuit Designer's Guide to... Flex and Rigid-Flex Fundamentals
Suggested Items
Jabil Recognizes Koh Young with the 2024 Best Strategic Supplier Award
12/10/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, has been honored with the 2024 Jabil Best Strategic Supplier Award.
SEMICON Japan 2024 Opens Tomorrow to Highlight Smart Applications Powered by Semiconductor Technology
12/10/2024 | SEMISEMICON Japan, the region’s premier microelectronics industry conference and exhibition, opens tomorrow at Tokyo Big Sight. With more than 1,000 exhibitors from 35 regions, the conference gathers leaders from across the microelectronics manufacturing supply chain from December 11-13. SEMICON Japan 2024.
Regal Rexnord, Honeywell To Collaborate On Solutions For Advanced Aircraft Mobility And eVTOL Markets
12/09/2024 | HoneywellRegal Rexnord Corporation and Honeywell announced that the two companies have entered into a multi-year collaboration to build technologies for the emerging Advanced Air Mobility (AAM) market and be installed on Electric Vertical Take-Off and Landing (eVTOL) aircraft.
SIA Commends CHIPS Act Incentives for Coherent, SkyWater Technology, X-FAB
12/09/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce, Coherent, SkyWater Technology, and X-FAB.
Closing the Loop: iNEMI Workshop Addresses Circularity Challenges
12/09/2024 | Kelly Scanlon, IPC Lead Sustainability StrategistThe electronics industry faces increasing pressure from consumers and regulators to implement more circular design principles in their products. While some companies lead the way, many grapple with significant knowledge gaps. These include a lack of clear definitions for "circular economy" in the context of electronics, insufficient data, and inadequate training to apply circular principles effectively across product lifecycles. Additionally, there's a pressing need to understand the return on investment (ROI) and other potential incentives for implementing circular principles.