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ExpressPCB Now Offers Electrical Test Option for PCB Orders
December 4, 2018 | ExpressPCBEstimated reading time: Less than a minute
ExpressPCB has announced the addition of Electrical Test as an option for PCB customers in our latest versions of both ExpressPCB Classic and Plus.
As project timelines shorten, and design parameters get tighter, the additional validation created by electrical test can keep you on your timeline and on budget.
“Our customers have asked for the option to add Electrical Test, and we are happy to now provide the peace of mind that your boards will match the design files as submitted. This allows a seamless flow of the PCBs straight to assembly, further streamlining your time from design to finished product,” said Michael Hebda, ExpressPCB product manager.
ExpressPCB continues to add features and services that allow design engineers to be as efficient as possible. We help bring your ideas to life with free CAD Software, coupled with the highest quality, lowest manufacturing costs possible. Time is money, and reducing design cycles and validation time can have a huge impact on your project.
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Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.