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Embedding Components, Part 5: Alternative Termination Methodologies and Surface Plating Variations
Embedding discrete passive components in a multilayer PCB combines two process disciplines: PCB fabrication and SMT assembly. Locating a supplier with both capabilities may be a challenge; however, a growing number of PCB fabricators have installed SMT assembly capabilities, or they have partnered with a company already established to offer assembly services.
Because they are furnished with a very thin profile, resistor and capacitor components with different values can be mounted directly onto land patterns on a subsurface layer of the printed circuit structure. However, handling and placing of these small components requires systems with a high level of positional accuracy. Interconnection can be accomplished using either deposited solder paste and reflow processing or applying a conductive polymer material. Due to the extremely small land pattern geometries required for mounting the miniature passive components, companies commonly rely on precision dispensing these materials.
Component Attachment Site Preparation
Land patterns for embedded passive components—previously explained in Part 4 of this series—furnish geometries that maximize adhesion and ensure electrical interface between the terminals and lands of the components.
Key attributes for solder or conductive polymer process control include:
- Uniform surface planarity
- Minimal intermetallic propagation
- Inhibited surface oxidation
The surface finish on the passive component terminals and the land patterns provided on the substrate must enable a reliable electrical and mechanical interface.
Solder Processing
The alloy composition commonly furnished on discrete passive component terminals is tin (Ag) over nickel (Ni) base plating. AgNi-plated component terminals will be compatible with any one of the commercially available lead-free solder alloy compositions listed in Table 1.
To read this entire column, which appeared in the November 2018 issue of Design007 Magazine, click here.
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Designers Notebook: Addressing Future Challenges for Designers
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
Designer's Notebook: Heterogeneous Integration and High-density SiP Technologies
Designers Notebook: PCB Design and IPC-CFX for Assembly Automation
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2