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Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
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Designer's Notebook
Column from: Vern Solberg
Vern Solberg is a technical consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the electronics industry for more than thirty-five years in areas related to both commercial and aerospace electronic product development and is active as an author and educator. Solberg holds several patents for IC packaging innovations including the multiple die and folded-flex 3D package technology and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology a McGraw-Hill publication.