-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Mentor Webinar January 23: Electro-Mechanical Co-Design
January 8, 2019 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Poor communication between PCB designers and mechanical engineers can cause projects to miss their time-to-market and cost targets by 50% or more. When these teams can collaborate in real time to develop a virtual prototype of the finished product, they can be assured that the PCBs will fit perfectly in their mechanical housing prior to fabrication.
This live webinar, scheduled for January 23, 2019, will reveal how electro-mechanical co-design can enable you to meet your cost and time-to-market goals, allowing you to beat your competitors to market and deliver higher quality products.
Presenters are John McMillan, a member of the PADS Technical Marketing team, and Brent Klingforth, a technical marketing engineer.
What Attendees Will Learn
- How to break down the barriers between PCB design and mechanical design domains with PADS Professional’s MCAD Collaborator
- Demonstration of an actual electro-mechanical co-design session from the PCB designer and MCAD tool user’s perspective
- How to accelerate time-to-market, eliminate re-spins, and reduce product cost with electro-mechanical collaboration
Who Should Attend
- PCB and mechanical designers
- CAD managers
To register, click here.
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.