Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
IPC Executive Forum Focuses on Advancing Automotive Electronics
January 9, 2019 | IPCEstimated reading time: 1 minute
Attention fabricators and builders of PCBs, flexible circuits, and other high density interconnects and antennae for military and 5G applications: Do you need high reliability with very fine feature sizes to operate in rugged environments?
As automotive is shifting from mechanical to electronic systems that must operate in rough environments they demand high reliability, ruggedized systems that may be more demanding than military applications according to the CEO of one fabricator.
A substrate supplier reports that several of his OEM military customers that asked for new special materials to be developed that they were shocked to learn that it has already been developed and is in use in the automotive space.
Another fabricator learned that his needs for a dry film imaging system for 15 micron feature sizes with his new direct imaging system had already been developed for substrate suppliers to Tier 1 providers in the automotive supply chain.
Has software been developed to increase reliability in assembly? What tests are being performed in the automotive space that could benefit the reliability of military electronic systems? What are Tier 1 automotive companies requiring for reliability?
All these and more will be covered by speakers from Asia to Europe in the Executive Forum for Advancing Automotive Electronics at IPC APEC EXPO 2019.
One CEO of a military fabricator said, “I will admit I had previously scanned the agenda for Monday and thought there was nothing for PCB execs as I only noticed the EMS executive forum. Maybe I should read things more carefully… But in any case, you should highlight that your event would be relevant to PCB execs.”
Did you miss this, too? It is not too late. You can still register for this January 28 not-to-be-missed event.
Share on:
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.