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IPC Executive Forum Focuses on Advancing Automotive Electronics
January 9, 2019 | IPCEstimated reading time: 1 minute
Attention fabricators and builders of PCBs, flexible circuits, and other high density interconnects and antennae for military and 5G applications: Do you need high reliability with very fine feature sizes to operate in rugged environments?
As automotive is shifting from mechanical to electronic systems that must operate in rough environments they demand high reliability, ruggedized systems that may be more demanding than military applications according to the CEO of one fabricator.
A substrate supplier reports that several of his OEM military customers that asked for new special materials to be developed that they were shocked to learn that it has already been developed and is in use in the automotive space.
Another fabricator learned that his needs for a dry film imaging system for 15 micron feature sizes with his new direct imaging system had already been developed for substrate suppliers to Tier 1 providers in the automotive supply chain.
Has software been developed to increase reliability in assembly? What tests are being performed in the automotive space that could benefit the reliability of military electronic systems? What are Tier 1 automotive companies requiring for reliability?
All these and more will be covered by speakers from Asia to Europe in the Executive Forum for Advancing Automotive Electronics at IPC APEC EXPO 2019.
One CEO of a military fabricator said, “I will admit I had previously scanned the agenda for Monday and thought there was nothing for PCB execs as I only noticed the EMS executive forum. Maybe I should read things more carefully… But in any case, you should highlight that your event would be relevant to PCB execs.”
Did you miss this, too? It is not too late. You can still register for this January 28 not-to-be-missed event.
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