-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
The Electronic Component Shortage Crisis: A Veteran Engineer’s Perspective
February 18, 2019 | John Watson, CID, Legrand Inc.Estimated reading time: 1 minute

Most of us are familiar with the defense readiness condition (DEFCON) levels. If we could apply such a DEFCON level to the electronics industry and how it relates to the issue of component shortages, we would be sitting at a DEFCON 1, meaning nuclear war is imminent.
This issue has a huge effect on everyone who works in the electronics field, impacting schedules and how things are done. The problem began to hit in earnest about a year ago in 2017. It first appeared as longer lead times on multilayer ceramic capacitors (MLCCs) and tantalum capacitors. With longer lead times, the available stock began to disappear, and before we knew it, we had a perfect storm and an international crisis.
From where we stand now, at the beginning of 2019, we see lead times for some components in the short range of up to 16 weeks; medium-to-high is 32 weeks, and long lead times are as far out as 80 weeks. In other words, if we ordered a component today, it would arrive in over a year a half from now (maybe).
This all started with the capacitors (we will see why later), but we now see other component series being sucked into this problem.
With such volatility in the market, it has brought those who were not prepared for it to a standstill.
What Is Driving This Crisis?
It has come down to a simple principle of economics supply and demand. While the supply has gone way down, the demand for many components has exploded. The component manufacturers have not kept pace with the demand for several reasons.
There are three main sectors of the electronic industry driving these component shortages.
To read this article, which appeared in the January 2019 issue of Design007 Magazine, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Leadership Change at Koh Young Europe
08/14/2025 | Koh YoungAfter 16 years of leading Koh Young Europe as General Manager, we would like to announce that Harald Eppinger will step down from his executive role.
TTM Technologies, Inc. Announces Retirement Plans of its CEO and Proceeds with CEO Successor Search
08/04/2025 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (“PCB”), today announced that Thomas T. Edman, the company’s President and Chief Executive Officer, intends to retire following the appointment of the company’s next President and CEO.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.