- 
                                  
- News
-  Books
                        Featured Books
- smt007 Magazine
Latest IssuesCurrent Issue  Production Software IntegrationEMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?   Spotlight on IndiaWe invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.   Supply Chain StrategiesA successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception. 
- Articles
- Columns
- Links
- Media kit||| MENU
- smt007 Magazine
Thin-Film Tandem Cells Made of Perovskite and Cigse Semiconductors
February 15, 2019 | HZBEstimated reading time: 2 minutes
 
                                                                    An HZB team has fabricated and characterized a thin-film tandem solar cell made of perovskite and CIGSe. They relied on a simple, robust fabrication process that is also suitable for scaling up to large surface areas. The tandem solar cell is a fully thin film device with an impressive efficiency of 21.6%. With further improvements it might reach efficiencies above 30%.
Tandem solar cells consist of two semiconductors with different band gaps, enabling them to use a larger fraction of the solar spectrum for generating electricity. This concept is particularly successful when conventional absorber layers such as silicon or copper indium gallium selenide (CIGSe) are combined with the new metal-halide semiconductor perovskite. This is because perovskites convert the blue, high-energy portions of sunlight into electrical energy very efficiently, while silicon or CIGSe convert the red and near-infrared portions effectively.
CIGSe and Perovskite Thin Films Combined
HZB researchers have now combined a thin-film solar cell made of CIGSe with a thin layer of perovskite. The CIGSe thin film was grown on a substrate, resulting in a CIGSe surface that is typically rough and irregular. This has made the application of the perovskite top cell using wet-chemical methods more difficult thus far.
Ultrathin Layer Improves Cell Efficiency
The HZB team in cooperation with Eindhoven University of Technology has now for the first time improved the properties of the tandem solar cell by applying an ultra-thin yet conformal intermediate layer to the CIGSe layer, then spin-coating the perovskite layer onto it at the HySPRINT lab of HZB. The tandem solar cell produced in this way converts 21.6% of the solar spectrum into electrical energy. This power conversion efficiency remains stable.
Manufacture Requires Minimal Energy
Although tandem cells made of silicon and perovskite achieve even higher efficiencies so far, theoretically, CIGSe perovskite tandem cells could also achieve these efficiencies. In addition, the new CIGSe perovskite tandem cell is a fully thin film device. This means that the new tandem cell is made from thin layers of CIGSe and perovskite so that the material and energy consumed during its manufacture are extremely low.
Mass Production Feasible
“This tandem cell was fabricated on a rough, untreated CIGS bottom cell, which simplifies manufacture and represents an enormous advantage in terms of mass production“, Prof. Dr. Rutger Schlatmann, Director of the HZB Institute PVcomB, points out.
The tandem solar cell was realised on an area of 0.8 square centimetres, which is considerably larger than the square-millimetre areas commonly used in laboratory research.
“Record values are only recognised for areas of one square centimetre or more, yet our cell area is just slightly below this threshold. Therefore, we now focus to certify this tandem solar cell efficiency and its enormous performance by an independent institution“, says Prof. Dr. Steve Albrecht, head of a Young Investigator Group at HZB, funded by the Federal Ministry for Education and Research (BMBF).
Outlook: Possible Efficiencies of Over 30%
Using electron microscopy and other measurements, first author Dr. Marko Jost, a postdoc in Steve Albrecht's team, and his colleagues analysed the conformal layer structure of the tandem cell and were also able to determine the contributions of the individual sub-cells to the performance of the tandem cell. Their study points out ways to further improve monolithic perovskite/CIGSe tandem cells and achieve efficiencies of over 30%.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    