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February 28, 2019 | DigitimesEstimated reading time: Less than a minute
Foldable smartphones are gradually emerging as a new handset trend, promoting Taiwan PCB makers to make preparations for cashing in on the consequent market demand, according to a Digitimes report.
Smartphone vendors such as Samsung Electronics, Huawei, Oppo and TCL are releasing their respective foldable models, and their PCB supply partners in Taiwan are moving to re-design PCB layouts based on possible changes in internal specs of the new models and expect their average unit prices to pick up as a result. Diverse PCBs including flexible boards, rigid-flex boards, HDI (high density interconnect) boards and SLP (substrate-like PCBs) are all applicable to foldable smartphones, and therefore technologically-leading PCB makers in Taiwan can still maintain their leadership in the foldable handset application market.
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