Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

PCB Technologies Announces $38M Engagement with U.S. Aerospace and Defense Manufacturer

09/30/2026 | PRNewswire
PCB Technologies, continues to expand its operations in the U.S. aerospace and defense market, announcing a new agreement valued at approximately $38 million with a leading American defense and aerospace manufacturer.

Q/C Technologies Announces Research Collaboration with Sandia National Laboratories

09/30/2026 | Globe Newswire
Q/C Technologies, Inc.., a developer of next-generation optical computing solutions, announced a collaboration with the Center for Integrated Nanotechnologies (CINT) at Sandia National Laboratories (Sandia) to advance its proprietary optical processing unit (OPU) initiative for artificial intelligence inference.

Valens Semiconductor, onsemi Collaborate on Cost-Optimized MIPI A-PHY Sensor

09/23/2026 | Valens Semiconductor
Valens Semiconductor, a leading provider of high-performance connectivity chipsets, announced a collaboration with onsemi on a cost-optimized integrated sensor for high-volume 3-megapixel automotive camera applications.

BAE Systems Receives $16M to Qualify RH45® for Space Missions

09/17/2026 | PRNewswire
BAE Systems has received $16 million in Defense Production Act Title III funding via the Department of War's (DOW) Warfighting Investments, Resourcing, and Execution directorate to demonstrate and qualify its radiation-hardened 45 nanometer (nm) technology.

Qnity Expands AI-Driven Advanced Packaging with End-to-End Process Solutions

08/25/2026 | BUSINESS WIRE
Qnity Electronics, Inc. , a premier technology solutions leader across the semiconductor value chain, introduced a scalable materials solution platform that brings together metallization, bumping, dielectric, and fine-line patterning technologies to enable next-generation high-density and 3D integrated semiconductor systems.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in