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Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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Cadence Webinar: Preventing EMC Problems in IC Package and PCB Designs
March 8, 2019 | Cadence Design Systems, Inc.Estimated reading time: Less than a minute
EMC compliance is required by all commercial electronic devices to ensure safety, compatibility, and reliable operation.
Cadence Sigrity technology provides fast and accurate design analysis and performance verification without the need of a physical prototype—giving you powerful early issue detection and streamlined resolution.
Join Cadence Education Services and signal integrity/power integrity (SI/PI) expert Srdjan Djordjevic on March 14, 2019, 16:00 CET, for a free one-hour live webinar to find out what SI/PI analysis tools can do for you.
The webinar will show you how to include EMC simulations and analysis early in the design stage to help avoid costly redesigns. The demo utilizes the Sigrity PowerSIand OptimizePI (frequency domain) tools to show how SI/PI analysis supports EMC analysis and uses post-processing steps to identify radiated emissions.
Cadence Sigrity technology supports all layout systems (Mentor, Zuken, Altium, Cadence Allegro, Cadence SiP, Cadence Allegro Package Designer, and others)—giving you maximum flexibility with optimal compatibility.
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Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
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OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
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