-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
New eBook Explores Tips for Executing Complex PCB Designs
April 12, 2019 | The I-Connect007 TeamEstimated reading time: 1 minute
I-Connect007 is excited to announce the release of the latest title in our educational library: The Printed Circuit Designer’s Guide to… Executing Complex PCBs.
The Printed Circuit Designer’s Guide to… is an ongoing series specifically dedicated to educating printed circuit board designers and serves as a valuable resource for people seeking the most relevant design information available. Written by Scott Miller, COO of Freedom CAD Services, this book provides a set of guidelines for designing the most complex, high-speed circuit boards.
Designing a complex circuit board today can be a daunting task. Never before have PCB designers on the cutting edge faced more formidable challenges, both electrical and mechanical. Miller and his veteran PCB design team share real-world examples to help designers sharpen their game, from the planning stages and schematic capture through documentation and successful data handoff.
“At a time when the electronics industry is taking large leaps forward, this is a book for anyone working with PCB design and its countless and ever-changing steps, and will be the go-to reference for all of our designers at Legrand North America,” said John R. Watson, CID and senior PCB engineer.
Readers will learn how to design complex boards correctly the first time, on time. This book is a must-read for anyone designing high-speed, sophisticated PCBs.
Download your free copy today! You can also view other titles in our full library.
We hope you enjoy The Printed Circuit Designer’s Guide to… Executing Complex PCBs.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-7)
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.