The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Founder PCB Fills Key Technology Role
April 17, 2019 | Founder PCBEstimated reading time: 1 minute
Founder PCB, a leading provider of advanced printed circuit technology solutions, announced the hiring of Richard Sun to lead its R&D Institute. Headquartered in its Zhuhai, China campus, the R&D Institute is the hub of Founder’s technology development and implementation resources. In his new assignment, Sun will have a prominent role in collaborating with customers on next-generation interconnect strategies, linking the technical staff at the four China factories, and developing a comprehensive, executable technology roadmap for the company.
Sun comes to Founder from an accomplished career in interconnect technology development at one of the world’s leading enterprise hardware companies. “We are excited to add an executive of Richard’s caliber to the Founder PCB management team” says David Sun, president and CEO. “Our customers are driving rapid advancements in electronic interconnect systems and Richard will ensure that Founder remains at the forefront in bringing the right solution at the right time to our customers. His in-depth understanding of leading edge system architecture and the supporting interconnect technology requirements uniquely position him to understand customer challenges and the enabling printed circuit technologies”.
About Founder PCB
Founder PCB is a leading provider of advanced interconnect solutions to the enterprise, mobility, industrial, and communications markets. It serves a large, global customer base from four purpose-built factories in China—three in Zhuhai and one in Chongqing—providing industry-leading capabilities supporting high-speed/hybrid constructions, signal integrity characterization, HDI/ELIC, and NPI support.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.