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Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Registration Now Open for IPC Electronics Materials Forum
April 22, 2019 | IPCEstimated reading time: Less than a minute
The IPC Electronics Materials Forum is a new technical conference for engineers and managers that procure materials or want to understand the advancements in materials for the board, assembly, components, and protective layers.
Scheduled for November 5–7, 2019 in Minneapolis, Minnesota, the IPC Electronics Materials Forum will focus on materials for board fabrication, assembly, and post-assembly protection with an emphasis on the emerging technologies that challenge our existing materials set. Developments needed for the future will be addressed, and interactive panels will extend an open forum to discuss solutions to these challenges.
Registration is now open for the forum. For more information, click here.
Suggested Items
LPMS USA to Offer Live Molding Demos at IPC APEX 2025
02/07/2025 | LPMS USALPMS USA, a leader in low pressure molding solutions, is thrilled to exhibit at IPC APEX 2025. Join us at Booth #2300 for live molding demonstrations using the innovative KAPPA 1100H.
OE-A Elects New International Board of Directors
02/07/2025 | OE-AThe members of the OE-A (Organic and Printed Electronics Association) appointed Dr. Alain Schumacher, IEE, as the new Chair of the Board of Directors at the end of January. Dr. Luke Pan, Brilliant Optoelectronic Technology is the new Vice Chair for Asia. Dr. Carsten L. Herzhoff, Lohmann, and Dr. Chloé Bois, ICI, are elected as Vice Chair Europe and North America respectively.
New IPC White Paper Focuses on Use of Artificial Intelligence in Automated Optical Inspection in Electronics Manufacturing
02/06/2025 | IPCA new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs). According to data within the white paper, recent advancements in technology, particularly in Cloud AI, IoT and Smart Manufacturing, have provided opportunities to further enhance AOI performance.
Advancements in Thermal Management: Material Talk With DuPont
02/06/2025 | Marcy LaRont, I-Connect007As our DesignCon coverage continues, this insightful discussion featuring Mike Kwasny, business development manager at DuPont, delves into technologies and innovations in electronics manufacturing featuring their unique material solutions, including their Kapton film and Pyralux laminate lines.
European Chip Giants NXP, STMicroelectronics Prepare for Layoffs
02/06/2025 | I-Connect007 Editorial TeamWhile companies like NVIDIA dominate the headlines with announcements of record chip sales associated with AI, European chip makers that are more dependent on industrial and automotive electronics are under pressure as demands for their chips slow. NXP, headquartered in the Netherlands, recently announced disappointing financials, down 5% from the previous year, primarily due to softening demand in those markets.