-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueProper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Registration Now Open for IPC Electronics Materials Forum
April 22, 2019 | IPCEstimated reading time: Less than a minute
The IPC Electronics Materials Forum is a new technical conference for engineers and managers that procure materials or want to understand the advancements in materials for the board, assembly, components, and protective layers.
Scheduled for November 5–7, 2019 in Minneapolis, Minnesota, the IPC Electronics Materials Forum will focus on materials for board fabrication, assembly, and post-assembly protection with an emphasis on the emerging technologies that challenge our existing materials set. Developments needed for the future will be addressed, and interactive panels will extend an open forum to discuss solutions to these challenges.
Registration is now open for the forum. For more information, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Sept. 2025 SMT007 Magazine: An Eye on India
09/02/2025 | I-Connect007 Editorial TeamIndia is on track to become the world’s fastest-growing major economy within the next two years, and that momentum is already reshaping its electronics manufacturing sector. Whether you work with Indian suppliers or serve Indian customers, chances are the country will become a bigger part of your supply chain in the near future.
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs:
Neways Achieves SBTi Validation for Near-term Emissions Reduction Targets
09/01/2025 | Neways Electronics International N.V.Neways Electronics International N.V. commits to reduce absolute Scope 1 and 2 GHG emissions 54.6% by 2033 from a 2023 base year.
KIC Expands Footprint in Mexico to Deliver Faster, Localized Support
08/29/2025 | KICKIC, a leading provider of thermal process solutions for electronics manufacturing, has announced the expansion of its service capabilities in Mexico.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.