The Shaughnessy Report: The Designer of Tomorrow
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
Fresh PCB Concepts: PCB Stackup Strategies—Minimizing Crosstalk and EMI for Signal Integrity
Registration Now Open for IPC Electronics Materials Forum
April 22, 2019 | IPCEstimated reading time: Less than a minute
The IPC Electronics Materials Forum is a new technical conference for engineers and managers that procure materials or want to understand the advancements in materials for the board, assembly, components, and protective layers.
Scheduled for November 5–7, 2019 in Minneapolis, Minnesota, the IPC Electronics Materials Forum will focus on materials for board fabrication, assembly, and post-assembly protection with an emphasis on the emerging technologies that challenge our existing materials set. Developments needed for the future will be addressed, and interactive panels will extend an open forum to discuss solutions to these challenges.
Registration is now open for the forum. For more information, click here.
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