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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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IPC Assembly Quality Benchmark Survey Open to Participants Worldwide
April 24, 2019 | IPCEstimated reading time: 1 minute
The 2019 Study of Quality Benchmarks for Electronics Assembly, one of IPC’s most popular annual studies, is currently underway. The survey is online and available in both English and Mandarin Chinese. The deadline for participation is May 17.
This confidential survey is open to all companies that do electronics assembly worldwide, including OEMs and contract electronics manufacturing service (EMS) companies. Participants who complete the survey will receive the report on the findings at no cost.
The study covers the industry's most widely used and important quality measurements, including yields, defect rates, cost of poor quality, rework, test and inspection methods used, inventory accuracy, customer returns, supplier performance, certifications and more. Companies use the results to benchmark their operations to world-class quality measurements.
The report will show industry averages and percentile data by product type, region and company size tier. Product types covered in the survey include electronic end-products and systems, rigid PCBs, flexible circuits and rigid flex, rigid backplanes, molded boards, MCM-C-L-D, mechanical assembly, cable and wire harnesses, and discrete wiring terminals and connectors. The report will be published in English and Chinese in August of this year.
IPC protects the confidentiality of participants’ data using a secure survey platform and server. IPC publishes only aggregate results and does not share any company-specific information. The survey asks for the participants’ IPC company ID number, which is used to provide additional data security.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000+ member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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