-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
EIPC Workshop on PCB Bio-MEMS
April 25, 2019 | EIPCEstimated reading time: 1 minute
The EIPC (European Institute for the PCB Community), in collaboration with the University of Bath, will organize a four-hour workshop on PCB Bio MEMs on June 12, 2019, at the Falkensteiner Hotel & Asia Spa Leoben in Austria.
Bio-MEMS is an abbreviation for biomedical (or biological) micro-electromechanical systems (aka lab-on-a-chip). Given the strong market demand for more BioMEM devices, the commercialization of lab-on-chip devices is currently the “holy grail of the research community.” The lab-on-PCB approach is being followed in various research groups all over Europe, owing to its inherent upscaling potential: the PCB industry is well-established all around the world, with standardized fabrication facilities and processes, but commercially exploited currently only for electronics.
In the workshop, attendees will learn the following:
- Lab-on-chip technology, its potential and its commercialization challenges
- PCB-based Bio-MEMs prototypes already developed by European academics
- Competitive advantages of lab-on-PCB technology and market opportunities
- Technical issues in PCB Bio-MEMs fabrication
Registration is open to the PCB industry and at a reduced fee to EIPC, FED and ICT members.
To register, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Celestica Provides Update on New Operations in Fort Worth, Texas
05/15/2026 | CelesticaCelestica Inc. a global leader in data center infrastructure and advanced technology solutions, provided an update on its plans to establish operations in AllianceTexas in Fort Worth, Texas.
Interlink Electronics Reports Q1 2026 Results
05/15/2026 | Globe NewswireRevenue for the first quarter of 2026 increased 15% to $3.07 million, compared to $2.66 million in the first quarter of 2025. The increase was driven by higher shipments of the Company’s force-sensing and printed electronics products, partially offset by lower sales of its gas‑sensor products.
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
What Heterogeneous Integration Means for EMS Providers
05/14/2026 | Nolan Johnson, I-Connect007Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
Zhen Ding Reports Record 1Q26 Revenue; Up 1.6% YoY
05/14/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced its consolidated financial results for the first quarter of 2026. First quarter revenue reached NT$40,728 million, up 1.6% YoY and setting a record high for the same period. Net income was NT$2,047 million, and net income attributable to the parent company was NT$1,426 million, with EPS of NT$1.33.