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Unimicron to Pour $644 Million Into FC Substrate Biz Over 4 Years
May 13, 2019 | DigitimesEstimated reading time: 1 minute
Unimicron Technology plans to invest a total of NT$20 billion ($644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates through 2022 to tap business opportunities arising from 5G, artificial intelligence (AI) and big data, according to a Digitimes report.
The planned investment over the next four years will come from the company's own funds and bank loans, Digitimes adds. Unimicron's high-end substrate production lines are mainly in Taiwan.
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