-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ATI Selects Universal's Fuzion for High-Mix Production
May 15, 2019 | Universal InstrumentsEstimated reading time: 2 minutes
Assembly Technologies Inc. (ATI), an electronics manufacturing services provider with more than 30 years of experience, has added a Universal Instruments FuzionXC2-37 to its Charlotte, North Carolina production facility. The new surface mount platform was chosen for its ability to maximize efficiency and boost productivity in high-mix electronics manufacturing environments.
ATI provides quality end-to-end electronics manufacturing services for companies spanning various industries. ATI strives to help OEMs develop quality products as well as provide customers with a wide range of market and technology expertise. The company’s 30,000 square foot facility is located in the heart of Charlotte and its offshore subsidiary in Gujarat, India. Both facilities are equipped with the latest technology, capable of handling the most diverse assembly challenges.
FuzionXC2-37 is the ultimate single-machine solution for high-mix, low/medium-volume SMT requirements. It features 272 8mm feeder inputs that can support multiple products in a single setup. It also offers 29 random access tray inputs, strip tape and track feeder support. FuzionXC2-37 handles boards up to 508mm x 1300mm and supports a large component range from 01005 – 150mm square and 25mm tall, as well as unique parts such as press-fit, connectors, micro BGA, die and pin-through-hole.
“FuzionXC2-37 is an absolute differentiator in short-run NPI environments and we’re already reaping the benefits,” said ATI VP of Operations, Kunal Brahmbhatt. “Our changeover time has been reduced by at least 30% and, due to the extensive feeder capacity of FuzionXC, we’ve actually had to do less changeovers by running multiple products from a single feeder setup. FuzionXC gives us a huge advantage in this regard.”
Brahmbhatt continued, “Our operators find FuzionXC very easy to use, with an intuitive user interface and effective NPI tools. In addition, the versatility of this platform is enabling us to build a variety of products with minimal reconfigurations, saving us time and money. As a result, we’re able to offer our customers better value and help them get their products to market faster.”
Universal Instruments Vice President of Customer Operations, Brad Bennett noted, “ATI is a long-standing Universal customer with a vintage GSM Platform that has stood the test of time.” He added, “It’s great that we’re able to provide them with our latest-generation platform in a configuration that is ideal for their manufacturing model. FuzionXC should pay dividends well into the future and we’ll be there to support ATI for all of their production requirements.”
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.