The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
Elementary, Mr. Watson DFX—Basically a Basket of Crabs With Spreadsheets
Words of Advice: Your Company’s Design Process
May 16, 2019 | Andy Shaughnessy, Design007 MagazineEstimated reading time: Less than a minute
In a recent survey, we asked PCB designers to describe their company’s design process: Is it a rigid workflow they follow to the letter, or a process that allows for their individual techniques? Of course, the comments were illustrative.
- We just wing it
- There isn’t a clear workflow.
- Being a design bureau requires much flexibility when approaching each project, due to varying customer needs (The customer is typically right, regardless of the facts...LOL)
- We are a new company and we don't have yet a clear workflow. Indeed, we need one in place.
- Fortunately, I am just down the hall from the EEs who do the schematics, so we do a lot of back and forth. In the end, we review the schematics and layout, multiple times if needed. Also, as the librarian, I can sort of police the packages the engineers want to use. We don't always need the latest and greatest just because it's cool.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
SEMI Appoints Julie Rogers Executive Director of the ESD Alliance
05/01/2026 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the appointment of Julie Rogers as Executive Director of the Electronic System Design Alliance (ESDA), a SEMI Technology Community.
IBM, Dallara to Advance AI and Quantum-Powered Design for High-Performance Vehicles
05/01/2026 | IBMIBM and the Dallara Group, a world-leading racing and high-performance vehicle manufacturer, announced a collaboration to advance vehicle design and optimization using AI and explore the use of quantum computing.
SEMI ESD Alliance 2026 Outlook: Agentic AI to Transform Chip Design and Verification
05/01/2026 | SEMIThe Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives.
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in