ITW EAE Launches PCB Temp Monitoring for Prodigy Dispenser
May 20, 2019 | ITW EAEEstimated reading time: 1 minute
ITW EAE is introducing a patent pending option for the Camalot Prodigy dispenser that was developed to ensure process stability and increase yields for underfill applications. In applications where board heat is required, a constant product temperature through the dispense process is critical to ensure process stability and repeatability. Underfill materials vary in viscosity and filler types, therefore the heat requirement for the board also varies.
The new infrared temperature sensors measure in real time the top-side board temperature which allows the system to provide closed-loop control to maintain the product within the specified temperature range.
The sensors provide a closed loop, fail safe means to monitor and control the “top side” board temperature through each of the process zones (pre-heat, dispense heat and post-heat zones), which are typically used during the underfill process. The passive IR sensors can be configured in any or all three conveyor zones in single or dual lane systems.
“Closed-loop control of the heat process is critical when dispensing underfill,” said Hugh Read, ITW EAE Dispenser Group Business Manager. “Yields are impacted due to poor capillary flow when the board temperature is outside of specified tolerance range. IR sensors ensure higher quality by improving heat stability during the dispense process.”
About Camalot
Camalot is a brand of ITW EAE, a division of Illinois Tools Works, Inc. They are a leading manufacturer of automated dispensing equipment for the printed circuit board, semiconductor, hybrid, automotive, industrial and medical industries. ITW EAE brings together world-leading brands of electronics assembly equipment including MPM, Camalot, Electrovert, Vitronics Soltec, and Despatch. For more information visit www.itweae.com.
Suggested Items
New Version of the Machine Vision Software MVTec MERLIC Focuses on Easier Integration
04/03/2025 | MVTecMachine vision is playing an increasingly important role in the automation of industrial manufacturing processes.
IPC APEX EXPO Newcomer: Faith DeSaulnier of TTM Technologies
04/03/2025 | I-Connect007 Editorial TeamDuring the Newcomer’s Welcome Reception at IPC APEX EXPO, the I-Connect Editorial Team spoke with several first-time attendees. The following is our interview with Faith DeSaulnier, a process engineer based at TTM Technologies’ facility in Forest Grove, Oregon.
BrainChip Partners with RTX’s Raytheon for AFRL Radar Contract
04/03/2025 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI, today announced that it is partnering with Raytheon Company, an RTX business, to service a contract for $1.8M from the Air Force Research Laboratory on neuromorphic radar signaling.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.