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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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NPL Webinar on Effect of Bias on CAF Failures of Electronic Circuits
June 11, 2019 | NPLEstimated reading time: Less than a minute
High reliability in service is the key issue in today’s high-density electronic circuits. And the voltage applied to the electronic circuit plays a very important role in electrochemical reliability. Insulation resistance (IR) measurement has been widely used to predict and evaluate the reliability of electronic circuit. But the test voltages for existing IR measurement are only up to 300V. With the trend toward more electric vehicles, measurements need to be conducted at significantly increased voltages to understand potential new failure mechanism when using voltages up to 1,000V.
In line with this, the National Physical Laboratory will hold a webinar on July 16, 2019 to help the industry understand the effect of bias (up to 1,000V) on conductive anodic filament (CAF) failures of electronic circuits. For this webinar, NPL has commissioned a 1,000V IR test facility for demonstration.
For more information or to register, click here.
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KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
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The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.