Key Megatrends for MEMS, Sensors and Imaging at SEMI-MSIG Summit
June 20, 2019 | SEMIEstimated reading time: 1 minute
With MEMS and imaging sensor innovations driving an explosion of transportation, medical, mobile, industrial and other Internet of Things (IoT) applications, the stage is set for the SEMI MEMS & Imaging Sensors Summit, 25-27 September 2019 at the World Trade Center (WTC) in Grenoble, France. More than 400 industry experts are expected to gather for insights on the latest developments and trends across the supply chain. Registration is open now with early-bird pricing available until August 17, 2019.
System integration success stories and the industry’s response to growing demand for data harvesting and analytics with new Artificial Intelligence (AI) capabilities will highlight the event.
The summit will open with executive keynotes and feature MEMS and Sensors and the Imaging and Sensors tracks over the following two days.
Other Highlights
- MEMS and Imaging Technology Showcase—Several companies will stage live demonstrations of their products powered by MEMS, imaging and sensors devices as they compete for audience votes.
- The Joint Show Floor Exhibition is the place to see leading companies, technologies, and innovators driving the future of MEMS/imaging and sensors design and manufacturing.
- Networking events such as the welcome reception and a gala dinner for both MEMS and Sensors and Imaging & Sensors Summit attendees.
About SEMI
SEMI connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies.
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.