Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
Target Condition: Designing vs. Inventing
Dana on Data: The Missing AI-NPI Link
DownStream Moves to New Headquarters July 1
June 27, 2019 | DownStream TechnologiesEstimated reading time: Less than a minute
DownStream Technologies will be moving its corporate headquarters from 225 Cedar Hill St., Marlborough, Massachusetts 01752 to the following address:
DownStream Technologies
290 Donald Lynch Blvd
Suite 301
Marlborough, Massachusetts 01752
Please update your records accordingly. Thank you for your continued support.
Contact DownStream
508-970-0670
Share on:
Suggested Items
UNIST Partners with Fincantieri to Advance Eco-Friendly Energy Technologies
03/24/2025 | UNISTUNIST has entered into a strategic partnership with Fincantieri, Europe’s largest shipbuilder based in Trieste, Italy. Together, the two organizations aim to foster open innovation in the development of eco-friendly energy technologies through robust industry-university collaboration and support for technology startups.
Imec, ZEISS Intensify Collaboration with the Signing of a New Strategic Partnership Agreement
03/24/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and ZEISS Semiconductor Manufacturing Technology (SMT), a leading technology company in the optical and optoelectronic industry and supplier of key components for the production of microchips, are intensifying their collaboration to advance the NanoIC pilot line at imec with state-of-the-art semiconductor technology and manufacturing expertise for sub-2nm research and development.
STMicroelectronics Recognized as Top 100 Global Innovator 2025 for the Seventh Time
03/24/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has been named in the Top 100 Global Innovators 2025.
Ansys to Integrate NVIDIA Omniverse
03/20/2025 | ANSYSAnsys announced it will offer advanced data processing and visualization capabilities, powered by integrations with NVIDIA Omniverse within select products, starting with Fluent and AVxcelerate Sensors.
DuPont Interconnect Materials Enabling Advancements in Aerospace & Defense, Next-Gen Automotive, and AI
03/19/2025 | DuPontDuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in