-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueTraining New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
DownStream Moves to New Headquarters July 1
June 27, 2019 | DownStream TechnologiesEstimated reading time: Less than a minute
DownStream Technologies will be moving its corporate headquarters from 225 Cedar Hill St., Marlborough, Massachusetts 01752 to the following address:
DownStream Technologies
290 Donald Lynch Blvd
Suite 301
Marlborough, Massachusetts 01752
Please update your records accordingly. Thank you for your continued support.
Contact DownStream
508-970-0670
Suggested Items
Qorix, Qualcomm Cooperate to Drive the Future of Software-Defined Vehicles
02/07/2025 | Qualcomm Technologies, Inc.Qorix, a global provider of modular and integrated automotive middleware solutions, and Qualcomm Technologies, Inc., a leader in automotive platforms, announced a technology cooperation to help drive the future of software-defined vehicles (SDVs) with high performance, pre-integrated and scalable solutions designed to enable OEMs and tier-1 suppliers to develop next generation vehicles quickly and efficiently.
AIM Solder Acquires the Assets of Canfield Technologies
02/07/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials, is pleased to announce the acquisition of the assets of Canfield Technologies, a renowned producer of high-quality solders and fluxes since 1844.
Teledyne Completes Acquisition of Select Aerospace and Defense Electronics Businesses of Excelitas
02/05/2025 | BUSINESS WIRETeledyne Technologies Incorporated announced today the successful completion of the acquisition of select aerospace and defense electronics businesses from Excelitas Technologies Corp. (“Excelitas”) for approximately $710 million. The acquisition includes the optical systems business known under the Qioptiq® brand based in Northern Wales, UK, as well as the U.S.-based advanced electronic systems business.
Transparent Electronics Market to Reach $2611 Million by 2030
01/31/2025 | BUSINESS WIREThe Global Transparent Electronics Market was valued at $963 Million in 2023 and is anticipated to reach $2611 Million by 2030, witnessing a CAGR of 15.4% during the forecast period 2024-2030.
The Future of Electronics Manufacturing in APAC
01/30/2025 | Daniel Schmidt, MKS' ATOTECHThe Asia-Pacific (APAC) region is solidifying its leadership in electronics manufacturing, fueled by significant new investments from global industry leaders. This growth is driven by surging demand for high-performance components in key sectors like AI, autonomous vehicles, and sustainable energy, making strategic innovation in semiconductors and advanced electronics essential. APAC's strong supply chains further enhance its appeal to investors.