-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Design Is a Pivotal Piece of the Puzzle
July 3, 2019 | I-Connect007 Editorial TeamEstimated reading time: 3 minutes
As a field applications engineer at TTM Technologies, which has fabrication and manufacturing locations around the world, Julie Ellis sees a wide variety of customer design requirements. In this interview with the I-Connect007 Editorial Team, Julie explains how PCB designers can influence the development of the PCB. She shares a variety of tips and tricks that designers can implement early in the design process to help optimize fabrication and assembly later on and keep small issues from becoming big problems downstream.
Andy Shaughnessy: Julie, with your job you have a pretty circumspect view of design and manufacturing. Can you start by giving us an idea about your job and some of the designs that you see crossing your desk?
Julie Ellis: My main task is to support customers’ designs for manufacturability by understanding their requirements and providing stack-ups and design guidelines for rigid circuit boards that are within TTM fabrication capabilities and process tolerances. I also help customers understand how fabrication processes affect capabilities, so they accept design modifications that assist in manufacturing.
The work I see coming across my desk includes components for EV charging and power conversion, Lidar, radar, back-up and industrial scanning cameras, ultrasound, defibrillators, and glucose monitoring. They require stack-ups ranging from four-layer heavy copper boards to 32 layers with three lamination cycles and mechanical blind holes and advanced HDI, which I define as 0.4-mm pitch BGAs and smaller.
Oftentimes, I’m trying to help customers design products that can also easily be transferred over to Asia and run on mass volume production lines without any advanced requirements that add cost. I work to ensure that prototypes fabricated here in North America are already designed with pre-approved stack-ups to run without modification at the final production volume site or sites. TTM calls this Seamless Global Transfer, and it works best when implemented in the planning stages of a new design.
I also review designs for cost savings. For example, in Asia, materials are 40 to 50% of a fabricator’s cost, compared to less than 20% in the United States. When we get into high-volume manufacturing, optimizing material utilization can save a customer several percent on the final assembly if we can keep a lowered cost on the PCB by planning the PCB dimensions to fit very well on a fabrication panel. If the circuit board is small, TTM often works with our customers to calculate the best multiple-up array with rails for assembly that can still fit optimally on the fabrication panel. The most common fab panel size is 18” x 24”, but we also mass-produce 21” x 24” panels at many sites.
Shaughnessy: Sometimes, I get the feeling that the designers don’t realize how much control they have over the final product. What are some of the common errors that you see coming in that you wish that you could just tell the designer, “If you just did this...?”
Ellis: If you just…came to me for your stack-up and design rules first, I wouldn’t have to tell you that nobody can fabricate this design in mass production. I request of my customers that they come to me at initial startup of a product before they even bother to route any circuitry, because designs get so complicated that it’s very challenging for them to go back and make changes if they’ve violated standard fabrication design guidelines. It’s really stressful to explain to an engineer why his design isn’t suitable for mass production, so I prefer to avoid that like the plague.
To read the rest of this interview, which appeared in the June 2019 issue of Design007 Magazine, click here.
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.