-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Sierra Circuits to Hold Signal Integrity & Power Integrity Workshop
July 16, 2019 | Sierra CircuitsEstimated reading time: 1 minute
Sierra Circuits will host a SI/PI workshop presented by DesignCon 2017 Engineer of the Year, Heidi Barnes, and Signal Integrity Application Scientist, Tim Wang-Lee, from Keysight Technologies on September 12-13, 2019 at Levi's Stadium in Santa Clara, California.
This intensive signal integrity and power integrity workshop provides you with the necessary skills to tackle everyday SI and PI challenges with Keysight PathWave advanced design system (ADS).
The SI session starts with the holistic approach to solve any signal integrity problems by using analysis techniques such as eye diagram, mixed-mode S-parameters, time domain reflectometry (TDR) and single pulse response. The session continues to exercise the techniques in design and exploration of single-ended and differential channels. Finally, the SI workshop concludes with EM model extraction and investigation of application and standards.
In the PI sessions, we cover the elegant flat impedance design technique and explore the cohesive ADS Power Integrity eco-system. In the process of PI eco-system simulations, you will use impedance vs. frequency data to create measured models, estimate decoupling capacitance, and debug noise ripple on a power rail.
The combination of lecture and hands-on exercises allows attendees to explore the presented topics in real-time while being mentored by an expert in the field. The hands-on approach allows you to gain confidence in your ability to apply these skills on your own, at your workplace. You will learn to design, simulate and troubleshoot most common signal integrity and power integrity related issues.
To book a spot or have more information, email Lucy at lucyi@protoexpress.com.
Suggested Items
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
WellPCB, OurPCB Launch Low-Cost PCB Assembly and Custom Cable Assembly Solutions
05/29/2025 | ACCESSWIREWellPCB and OurPCB, world leading PCB manufacturing service providers, announced today that they have officially launched new Low-Cost PCB Assembly Solutions and Custom Cable Assembly services to meet the needs of the electronics manufacturing industry for high cost performance and flexible customization.
Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
05/29/2025 | SiemensSiemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
High-frequency EMC Noise in DC Circuits
05/29/2025 | Karen Burnham, EMC UnitedEMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.