Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Indium Expert to Explore Factors Driving Performance of Compressible Metal TIMs at TestConX China

10/28/2026 | Indium Corporation
Indium Corporation® Assistant Product Manager Foo Siang Hooi will discuss the critical factors that influence the performance of compressible metal thermal interface materials (TIMs) and their role in addressing the demands of next-generation cooling applications at TestConX China, October 29, in Suzhou, China.

Rehm Thermal Systems Introduces Vision RCC

10/28/2026 | Rehm Thermal Systems
Rehm Thermal Systems has launched the new Vision RCC, an innovative reflow soldering system specifically developed to meet the requirements of heavy and complex electronic assemblies.

Siemens Expands NVIDIA AI Collaboration for 3D IC Power and Thermal Challenges

10/27/2026 | Siemens
Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with NVIDIA.

Knocking Down the Bone Pile: Interposer Rework and Precision Solder Ball Attachment

10/28/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
An interposer is a thin substrate positioned between a semiconductor device, such as a BGA and PCBA, containing conductive features that allow electrical connections to be rerouted, recreated, or modified between the component and the PCB. Interposers may be manufactured from organic materials such as polyimide or FR-4, as well as silicon, glass, or other specialized materials. In PCB rework, they are most commonly used when the existing board design cannot easily be modified through conventional rework techniques.

Siemens, NVIDIA Expand Agentic AI Collaboration for 3D IC Power and Thermal Design

10/21/2026 | Siemens
Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with NVIDIA.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in