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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/21/2026 | Michelle Te, I-Connect007
Some situations came up for me this week (delayed flights and malfunctioning work software) that highlighted how much we rely on tools every day. When they’re working, we barely think about them. When they’re not, we’re suddenly reminded of everything else that has to be in place for the work to get done: good processes, knowledgeable people, communication, teamwork, and sometimes ingenuity. I’ve observed that engineers aren’t any different in their work.

Marcy’s Musings: The Power of the Electronics Ecosystem

08/19/2026 | Marcy LaRont -- Column: Marcy's Musings
Electronics hardware product design and manufacturing is a completely interconnected (pun intended) and interdependent system. Success depends on every part of the ecosystem functioning together, a reality that once seemed easy to ignore or sideline, but today, few have the time or resources to work independently.

Carano and ElectronicsU Debut New Course on Advanced Packaging

08/13/2026 | Nolan Johnson, I-Connect007
Mike Carano is an industry pioneer with deep expertise across multiple domains. In his latest course for the Global Electronics Association’s ElectronicsU platform, “Advanced Packaging: HDI Enabling Technology,” Carano delivers some of the first educational material introducing advanced packaging to the printed circuit supply chain. In this interview, he discusses the course content, target audience, and motivation for creating the course. 

Learning With Leo: Where Reliability Actually Hides

08/05/2026 | Leo Lambert -- Column: Learning With Leo
In my many years of training, it’s funny to see what still surprises people. For example, they’re surprised that by the time the solder melts, most of what decides whether that joint survives has already happened before the iron and even before inspection. In fact, it’s even earlier than that. In my column last month, I argued that most soldering problems are really problems of interpretation, which leads to the materials themselves, and where reliability is won or lost. So, let’s talk about what we’re actually soldering today.

Keeping Electronic Component Recovery and Reuse Closer to Home

07/29/2026 | Rob Ronan, Retronix Ltd.
Over the past several years, electronics manufacturers have been forced to rethink what supply chain resilience really means. Shortages, extended lead times, allocation pressures, obsolescence, and price volatility have exposed the limits of a procurement strategy built on the assumption that new components will always be available when needed. However, even when parts can be sourced, they may come with unacceptable lead times, inflated spot-market pricing, or concerns around authenticity and traceability.
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