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Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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EIPC SpeedNews: News from the European PCB Industry
August 21, 2019 | EIPCEstimated reading time: Less than a minute
- EIPC PCB Pavilion - What's New in Electronics, September 18–19, 2019
- EIPC-FED Technical Snapshot Fraunhofer IZM, Berlin, October 8, 2019
- Registration Form: Technical Snapshot Berlin, 8 October 2019
- Ilfa 40 Years (1979-2019) Celebration on May 9, 2019 in Hannover
- Annual Shareholders' Meeting at Schweizer Electronic AG
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