-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Mentor Paper: Accelerating RF PCB Design in a 5G World
August 21, 2019 | Mentor, a Siemens businessEstimated reading time: 1 minute
Today, IoT products are demanding higher frequencies and wider bandwidths than ever. Designs for devices like smartphones, tablets, laptops, and wearables will soon operate in a new spectrum with emerging 5G technologies. Meeting the challenges of 5G in RF PCB design requires an RF-centric design flow and support.
In this unique infographic, designers will learn what they need to meet the RF design challenges associated with 5G technology and how to accelerate your product design with a flow that not only understands RF design but also features capabilities that are specific to RF, from schematic to layout.
To download this paper by Mentor, a Siemens business, click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Sony Semiconductor Solutions, TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership
05/08/2026 | TSMCSony Semiconductor Solutions Corporation and TSMC announced the signing of a non-binding memorandum of understanding (MOU) to form a strategic partnership for the development and manufacturing of next-generation image sensors.
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
Molex Completes Acquisition of Teramount Ltd.
05/07/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
IBM, Aramco Explore Collaboration to Accelerate AI and Innovation Across Saudi Arabia
05/07/2026 | IBMAramco and IBM announced their intended collaboration on opportunities to advance artificial intelligence, agentic AI, automation, material science and other mutually agreed domains in the industrial sector.
Foxconn Launches Second-Gen LEO Satellite, Begins Inter-Satellite Link Testing
05/05/2026 | FoxconnFoxconn Technology Group, the world's largest electronics manufacturing services provider, announced that its second-generation low-Earth orbit (LEO) satellites, "Pearl-1A" and "Pearl-1B," were successfully launched into their designated orbits via SpaceX's Falcon 9 rocket on the evening of May 3 (Taipei time).