Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Marcy’s Musings: Old School vs. New School—When Does It Matter?

06/17/2026 | Marcy LaRont -- Column: Marcy's Musings
The battle between old and new is nothing new. Throughout history, technological progress has faced skepticism, resistance, and at times, outright hostility. Yet progress tends to win. In his book, "RenAIssance," author and APEX EXPO 2026 keynote Zack Kass illustrates this point beautifully. From hand weaving to sewing machines, from scribes to the printing press, from horse-drawn carriages to automobiles, and now to artificial intelligence, each technological leap has ultimately made our lives more productive and expanded what was possible.

SEMICON Taiwan 2026 to Serve as Global Stage Where the Semiconductor Industry Defines What’s Next

06/16/2026 | SEMI
SEMICON Taiwan 2026, one of the global semiconductor industry’s flagship annual events, will be held September 2-4 at the Nangang Exhibition Center in Taipei, with forums beginning on August 31 to align with International Semiconductor Week.

Adani Enterprises, Jabil Target Strategic Alliance for AI Data Center Infrastructure in India

06/16/2026 | Jabil Inc.
Adani Group, India’s leading integrated infrastructure and green energy conglomerate, and Jabil Inc., a global leader in engineering, supply chain, and manufacturing solutions, announced the intent to form a strategic alliance to establish a world-class, vertically integrated AI and data center infrastructure manufacturing platform in India.

Optical Interconnects Drive AI Factory Growth; CPO/NPO Market to Top $39B by 2030

06/15/2026 | TrendForce
TrendForce’s recent research on silicon photonics (SiPh) shows that the rapid growth of AI training and inference workloads is pushing AI data centers toward increased power use, higher rack densities, and larger clusters.

Advanced Packaging: A Central Axis of Innovation in A&D, Automotive

06/11/2026 | I-Connect007 Editorial Team
Presenters in the Aerospace & Defense Special Session at APEX EXPO 2026 made one message abundantly clear: Advanced packaging has moved from a supporting role to a primary system enabler, particularly in high-reliability markets where performance, longevity, and environmental resilience are non-negotiable. The March Technical Conference at APEX EXPO focused on advanced electronics for the first time this year, with two Special Sessions featuring a carefully curated selection of presentations examining how design priorities, material choices, and manufacturing strategies are evolving in response to these demands.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in