-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
IPC CEMAC 2019 Showcases Intelligent Future Driven by Data
August 30, 2019 | IPCEstimated reading time: 1 minute
More than 200 representatives from companies such as Huawei, CRRC, NASA, Foxconn, Vayo and JWI Software gathered in Shenzhen, China for IPC CEMAC 2019. This year’s theme, “Intelligent Future Driven by Data,” provided attendees insight into Industry 4.0, the Internet of Things (IoT), electronic component 3D digital design, the use of data to drive intelligent manufacturing and the demand for high quality/highly reliable products.
Peter Chiang, vice president, IPC Greater China, opened the annual members-only event, with an introduction to the implementation of Industry 4.0 and release of IPC-2591, IPC’s connected factory exchange standard. Huang Chunguang, Huawei Technologies, Co. Ltd., discussed the important role of 3D digitalization of electronics components during his presentation, “Software Defines Manufacturing, Data Drives the Future.” Luo Jiapeng, Foxconn, introduced Foxconn’s SMT Industrial Internet blueprint and framework during his presentation, “Data -- the Foundation of Intelligent Manufacturing.”
In addition, presentations were given by: Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Chen Zhiman, CRRC Times Electric; Johnsson Per Anders, JWI Software; Liu Fengshou, Vayo; and Du Yunliang, Mentor Graphics – a subsidiary of Siemens. The event provided ample time for professionals from various industries including aerospace, railway, telecommunication and electronics manufacturing to network with speakers.
“China accounts for up to 38 percent of the global electronics industry production capacity of nearly 2 trillion USD,” said David Bergman, IPC vice president, standards and training. “The rapidly growing Chinese electronics industry market share creates opportunities and challenges for domestic electronics-related enterprises. As a global electronics industry association, IPC is committed to the promotion of technical exchanges and providing enterprises with the latest technical standards and training to drive further development of the industry. IPC’s annual CEMAC event provides the perfect backdrop for these technical exchanges.”
Next year’s IPC CEMAC will be located in Shanghai. For more information about this event or other IPC-sponsored events in Asia Pacific, visit www.ipc.org.cn.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.