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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
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Posters Sought for IPC APEX EXPO 2020
September 5, 2019 | IPCEstimated reading time: Less than a minute
IPC is inviting the industry to submit technical posters for the upcoming IPC APEX EXPO 2020. Delivering a technical poster at the industry's premier conference on electronics manufacturing provides significant visibility for you and your company on your research and knowledge.
Thousands of individuals will attend IPC APEX EXPO, ensuring that your work is seen by key engineers, managers and executives from all segments of the global electronics industry. Posters will be displayed throughout the event. Poster presentations are scheduled for Wednesday, February 5, offering additional visibility.
Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes and equipment.
The deadline for submission of abstracts is November 15, 2019.
To submit posters, click here.
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