Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
Fresh PCB Concepts: The Power of a Lunch & Learn for PCB Professionals
The Shaughnessy Report: Solving the Data Package Puzzle
Words of Advice: What Feature Would You Like to See in Your CAD Tool?
September 16, 2019 | I-Connect007 Research TeamEstimated reading time: Less than a minute
In a recent survey, we asked the following question: What feature would you like to see in your CAD tool? Here are a few of the answers, edited slightly for clarity.
- Proper support for flex stiffeners and upgraded signal integrity simulation.
- Compatibility and flexibility in and EDA design tool is a challenge.
- PCB current carrying capacity DRC.
- A better process flow.
- Better documentation.
Share on:
Suggested Items
Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025
05/19/2025 | Indium CorporationAs a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.
Siemens to Bring Advanced Timing Constraint Capabilities to EDA Design Flow with Excellicon Acquisition
05/19/2025 | SiemensSiemens has entered into an agreement to acquire Excellicon to bring its best-in-class software for the development, verification, and management of timing constraints to Siemens’ EDA portfolio of software for IC design
Canadian Circuits Inc. Unveils Rapid Prototype PCB Assembly Service to Accelerate Innovation
05/14/2025 | Canadian Circuits, Inc.Canadian Circuits Inc. (CCI), a leading provider of high-quality, made-in-Canada, Printed Circuit Board (PCB) solutions, is proud to announce the launch of its Prototype PCB Assembly (PCBA) service. This new offering enhances CCI’s commitment to empowering engineers and OEMs by accelerating the journey from concept to product launch with precision and efficiency in electronics manufacturing.
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
American Standard Circuits to Exhibit and Speak at SMTA Oregon Expo
05/14/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will be exhibiting SMTA Oregon Expo & Tech Forum to be held on May 20 at the Wingspan Events and Conference Center in Hillsboro, Oregon.