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North America EDA Market to Reach $9.70 Billion in 2027
September 16, 2019 | Business WireEstimated reading time: 2 minutes
The North America electronic design automation market accounted for $4.10 billion in 2018 and is expected to grow at a CAGR of 10.2% over the forecast period 2019-2027, to account for $9.70 billion in 2027.
The significant growth of the semiconductor industry is anticipated to boost the electronic design automation market growth. Moreover, the increased focus on miniaturization of electronic devices is expected to boost the electronic design automation market growth in the forecast period. The SIA (Semiconductor Industry Association) in October 2018, while representing the US leadership in semiconductor research, design and manufacturing had charted an increase of 12.7% from 2017 and marked the total revenue of $41.8 billion.
Furthermore, the WSTS also forecasted a trajectory of 15.9% in 2018 and 2.6% in 2019. This growth in the semiconductor industry has raised the confidence of the market players in terms of revenue growth. The companies operating in the semiconductor landscape are not only anticipating a substantial rise in the revenue but are also respectively increasing their R&D spending. The year-on-year increase in R&D spending has imposed a noteworthy thrust to the electronic design automation market during the recent past and is projected to continue to drive the market in the coming years.
As the semiconductor industry continues to be in strong up-cycle, the leaders in the market are expected to adopt a future-oriented approach. The approach may further consider unconventional end-market such as artificial intelligence, autonomous vehicle, and IoT. Additionally, the memory companies are also likely to witness a rise in sales owing to bolstering demand for data centers smartphones and autonomous vehicle technologies.
The electronic design automation market is fragmented in nature due to the presence of several industries, and the competitive dynamics in the market is anticipated to change during the coming years. In addition to this, various initiatives are undertaken by the governmental bodies to accelerate the electronic design automation market further. For instance, the US government has taken various initiatives for supporting the manufacturing sector in the country.
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Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.