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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC Designs for Excellence in Conjunction with PCB Carolina
September 17, 2019 | IPCEstimated reading time: 2 minutes
IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (design for manufacturing) DFR (design for reliability) DFA (design for assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Conference and Training Center.
Providing a comprehensive review of pitfalls that can occur in assembly and how they often have a direct link to design, the seminar will be led by instructor Dale Lee, senior staff DFX strategy engineer, Plexus Corporation.
Geared toward designers, manufacturing/process engineers, quality and reliability engineers, and managers or technicians involved in the design, fabrication, assembly or testing of printed board assemblies, attendees will learn:
- The effect of bare board choices on function and reliability of assembly
- How PCB design complexity impacts on fabrication costs and reliability
- Limitations of industry standards
- PCB design effects on assembly: thermal balance, trace routing, via interconnection, Z-axis TCE
- Impacts of component and PCB warpage/flatness on yields and reliability
- Impacts of design on process control issues; paste volume, SMT and PTH thermal shock, reflow warpage
“There is a direct connection between the design of a device and complications that may occur in the assembly process,” said Brook Sandy-Smith, IPC technical conference program manager. “This course will shine a light on those opportunities for improvement, taught by a distinguished expert in the field.”
For more information on Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly) or to register, visit www.ipc.org/DfX-workshop.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,400 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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