Dan’s Biz Bookshelf: ‘Do/Start'
Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
It’s Only Common Sense: Stop Pitching, Start Listening
Atotech to Participate at IPCA Expo in India
September 23, 2019 | AtotechEstimated reading time: 1 minute
Atotech, a worldwide leader in providing specialty chemicals and equipment for the printed circuit board, IC substrate and semiconductor industries, will participate in this year's edition of IPCA Expo. The trade fair will be co-located with electronica India, productronica India, and Smart Cards Expo on September 25–27, 2019, in Halls 11 and 12 of the India Expo Centre in Greater Noida, Delhi, India.
The Indian Printed Circuit Association (IPCA) and the IPCA Expo promote state-of-the-art PCB technology and business in India by mutual exchange of ideas and technical interactions. This trade fair brings the entire PCB industry ecosystem and value chain together. It will showcase the latest PCB technologies from manufacturers and suppliers from across the globe to facilitate the growing demand of PCBs in various industry segments.
Visitors to the trade fair are invited to stop by Atotech's booth E109 in Hall 11 to talk to the Group's PCB experts and to learn about their latest innovations, including wet chemical process and equipment solutions.
Atotech's key highlights at IPCA Expo 2019 include the following:
- Polygon PLB Line—is Atotech's new desmear and electroless copper line for excellent blind micro via filling capability enabling high reliable multilayer, rigid-flex and HDI PCB production
- ViaKing—is an enhanced graphite-based, cost effective, but technically very capable direct metallization process for flex, multilayer, HDI and exotic base materials.
- OS-Tech—is an environmentally friendly, high functioning simple process. It can guarantee multiple solder reflow cycles whilst ensuring that the pretreatment can optimize the copper surface best-in-class and therefore facilitate an even OSP coating.
About Atotech
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computers; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support—making Atotech a critical partner to over 8,000 customers worldwide.
Atotech is a team of 3,800 experts in over 40 countries generating annual revenues of $1.2 billion (2018). Atotech has manufacturing operations across Europe, the Americas, and Asia and its headquarters is located in Berlin, Germany.
Share on:
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.