It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
iNEMI Call for Participation Webinars on October 8 and 9
September 26, 2019 | iNEMIEstimated reading time: Less than a minute
The emergence of advanced electronics packaging and adoption of heterogeneous integration and system-in-package (SiP) is leading to the use of larger packages. The larger form factors pose unique challenges in semiconductor assembly (chip-to-package), as well as PCB assembly (package-to-board).
iNEMI has a new project, Back End Commonality for Advanced Packaging: Large Form Factor, that will focus on defining large form factor product-handling media (carriers, trays, etc.) for back end processes that can accurately and cost-effectively manage larger package sizes while also allowing for production flexibility and higher density.
iNEMI's new project plans to:
- Address gaps for the assembly of large form factor packages while providing flexibility
- Develop media handling guidelines for large-sized advanced packages (>50mm x 50mm)
- Demonstrate the cost-effectiveness of leveraging commonality
- Provide input to the appropriate standards bodies regarding materials handling for large form factor packages
In line with this, iNEMI will be holding a call-for-participation webinar scheduled for October 8 (Americas and EMEA) and 9 (APAC). The webinars are open to the industry (iNEMI membership not required).
For additional information, contact Urmi Ray at urmi.ray@inemi.org.
Share on:
Suggested Items
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
CIL Installs Third Volume Auto SMT Line with In-Line 3D AOI at BP2 Facility
11/25/2024 | CILIn early November 2024, CIL completed the installation of its third volume SMT PCBA assembly line at its BP2 Semiconductor Packaging facility
Real Time with... electronica 2024: SPEA's AI Integration—Innovations in Test Equipment
11/25/2024 | Real Time with... electronicaIn this interview from electronica 2024, Pete Starkey speaks with Andrea Furnari, VP of Electronic Test Products Business Unit for SPEA. The discussion revolves around AI integration in test equipment, trends in substrate materials, and SPEA's focus on R&D.
Winners of IPC Hand Soldering World Championship at electronica 2024 Announced
11/21/2024 | IPCIPC hosted its Hand Soldering World Championship in Munich, Germany, at electronica on 14-15 November 2024, welcoming 14 competitors from 13 companies and 12 countries worldwide. Skilled contestants competed to build an electronics assembly in accordance with IPC-A-610 Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process and overall product quality. The contestants were allowed a maximum of 60 minutes to complete the assembly.
PCB Carolina’s Formula: Industry Experts and Catered Food
11/18/2024 | Andy Shaughnessy, Design007 MagazinePCB Carolina organizers at the Better Boards design bureau seem to have found the perfect formula: Industry experts plus catered food equals a constantly expanding show. This one-day tabletop show has been growing for two decades, and that trendline continued with this year’s event on November 13.