The Right Approach: Get Ready for ISO 9001 Version 6
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
It's Only Common Sense: The Evolution of Prospecting
iNEMI Call for Participation Webinars on October 8 and 9
September 26, 2019 | iNEMIEstimated reading time: Less than a minute
The emergence of advanced electronics packaging and adoption of heterogeneous integration and system-in-package (SiP) is leading to the use of larger packages. The larger form factors pose unique challenges in semiconductor assembly (chip-to-package), as well as PCB assembly (package-to-board).
iNEMI has a new project, Back End Commonality for Advanced Packaging: Large Form Factor, that will focus on defining large form factor product-handling media (carriers, trays, etc.) for back end processes that can accurately and cost-effectively manage larger package sizes while also allowing for production flexibility and higher density.
iNEMI's new project plans to:
- Address gaps for the assembly of large form factor packages while providing flexibility
- Develop media handling guidelines for large-sized advanced packages (>50mm x 50mm)
- Demonstrate the cost-effectiveness of leveraging commonality
- Provide input to the appropriate standards bodies regarding materials handling for large form factor packages
In line with this, iNEMI will be holding a call-for-participation webinar scheduled for October 8 (Americas and EMEA) and 9 (APAC). The webinars are open to the industry (iNEMI membership not required).
For additional information, contact Urmi Ray at urmi.ray@inemi.org.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Naprotek Appoints Mark Crebs to Lead Business Development for Products and Platforms
08/27/2025 | Naprotek LLCNaprotek, LLC, a leading provider of mission-critical electronics technology solutions, announced the appointment of Mark Crebs to Products and Platform Director of Business Development.
VVDN Expands Manufacturing Footprint into the UAE to Meet Global Demand
08/20/2025 | PRNewswireVVDN Technologies, a global provider of software, product engineering and electronics manufacturing services & solutions, today announced it is setting up a new manufacturing facility in the UAE as part of its global expansion strategy.
SisTech Manufacturing Expands Services: Leading Precision in Electronic Manufacturing
08/11/2025 | Globe NewswireSisTech Manufacturing, known for its expertise in precision electronic manufacturing services, is expanding what it can do in production. For over 30 years, the company has been recognized for its commitment to quality and its ability to meet the diverse demands of industries like aerospace and consumer electronics. With ISO 9001:2015 certification and ITAR registration,
Kaynes Circuits to Invest $570 Million in PCB Tech India’s Tamil Nadu State
08/07/2025 | I-Connect007 Editorial TeamKaynes Circuits India, a subsidiary of Kaynes Technology India, announced on Aug. 4 that it plans to invest roughly $570 million over the next six years in the southern state of Tamil Nadu, the Economic Times reported.