Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
ODB++: Transforming Ideas Into Products
October 9, 2019 | Max Clark, Mentor, a Siemens BusinessEstimated reading time: 1 minute
This year, I witnessed an impressive natural event that I had never experienced before in all my life as a native Californian. The painted lady butterfly migration starts from the southeastern deserts of California heading northwest to Oregon, Washington, and further north into Alaska. While that distance covered by a butterfly with a wingspan of 2–3 inches is amazing, what was so impressive was the sheer number of them. This year’s migration represented one billion butterflies, all striving to survive the long journey north. Throughout California, one could simply step outside to witness the most elegant stream of butterflies, one after the other, for days on end.
What does a butterfly migration have to do with transferring intelligent PCB data from design through the manufacturing process? The process of transforming from an earthbound caterpillar into a beautiful flying butterfly where each has a unique wing pattern is not much different than transforming an idea for a product into a schematic, and through hard work, into a unique PCB design. The difference is that nature has created a perfectly connected process, but we still are challenged doing our same process repeatedly with positive results. In the case of a PCB design, the transfer of the design intent and the manufacturing process needs are not yet connected in unison.
The ODB format originated with the objective of delivering on this need. The format was originally introduced for use by PCB fabricators, eliminating the need for a collection of CAM files in multiple formats—such as Gerber, Excellon, IPC-356, or even IPC-350, which was an early attempt to simplify this process. The key to the success of ODB was that it obtained industry acceptance. There was a friendly, informal group working together as early adopters put aside their previous thinking in the hopes of achieving a quick transformation from an effective product model into a deliverable PCB with the minimal amount of data manipulation possible, and in an effective, repeatable, and reliable manner.
To read this entire article, which appeared in the September 2019 issue of Design007 Magazine, click here.
Share on:
Suggested Items
From Execution to Intelligence: A Data-driven Approach to Modern Manufacturing
05/06/2025 | Barry Matties, I-Connect007In this discussion, Augusto Vilarinho, an MES expert at Critical Manufacturing, explores the essential functions of MES in tracking and tracing shop floor activities where AI and machine learning capabilities are purposely built into the MES through it's embedded data platform, capturing all machine data, integrating and connecting with different systems, ERPs, physical equipment, and people.
Join the Conversation: MESI 4.0 Summit 2025 Brings Manufacturing Experts to Porto
05/06/2025 | Critical ManufacturingThe MES and Industry 4.0 International Summit 2025 (MESI 4.0 Summit), hosted by Critical Manufacturing, will bring together manufacturing leaders, technology experts, and industry pioneers in Porto on June 12-13, offering a unique platform to explore practical strategies for digital transformation and smart manufacturing.
AMI achieves 52 consecutive weeks of First Pass Yield Rates above 98.72%
05/06/2025 | Alternative Manufacturing, Inc.AMI, a leading provider of high-quality PCB assembly (PCBA) solutions, proudly announces the achievement of 52 consecutive weeks of first pass yields at test, maintaining an exceptional success rate of 98.72% or better. This remarkable accomplishment underscores the company's unwavering commitment to manufacturing excellence, quality assurance, and customer satisfaction.
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
05/06/2025 | Chris Mitchell -- Column: The Government CircuitThere is certainly no shortage of work to be done in the IPC Government Relations department, as the U.S. waged a tariff campaign on practically every industrial country in the world and several countries embarked on high-tech initiatives with a mix of approaches to the crucial foundations of electronics manufacturing. Indeed, the breadth and speed of U.S. President Donald Trump’s tariff campaign continues to be a serious challenge for our industry.
Dixon, Inventec Form JV for PC Manufacturing in India
05/05/2025 | DixonDixon has entered into Joint Venture Agreement (JV Agreement) with Inventec. Pursuant to the said JV Agreement, Dixon IT Devices Private Limited (JV Company) will be 60% owned by Dixon and 40% owned by Inventec.