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IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.
The forum will focus on materials for board fabrication, assembly, and post-assembly protection. The over-arching theme of emerging technologies that challenge our existing materials set will inform attendees on developments needed for the future. Interactive panels will also extend an open forum to discuss solutions to these challenges.
Maria Kogia of ANYSYS/Granta will be one of the speakers for the said event, where she will explain how the collaboration between experts in Organic Electronic (OE) manufacturing, materials-to-device physical testing and modelling, and materials information management technology helps to create best practices for digitization of OE workflows.
For more information or to register, click here.
