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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Sun Chemical to Introduce New Solder Mask for High-temperature Automotive Applications at productronica 2019
October 22, 2019 | Sun ChemicalEstimated reading time: Less than a minute
Sun Chemical will introduce its new Imagecure solder mask for high-temperature automotive applications during productronica 2019 in Munich, Germany from November 12-15, 2019.
The most recent addition to the most-used solder mask in Europe, withstands all the latest thermal cycling test criteria at -40°C/+180°C for 1000 cycles and -40°C/+170°C for 2000 cycles—a high specification test for printed circuits that must handle the stress caused by increased operating temperature requirements being introduced in automotive applications.
Visitors of Sun Chemical’s booth located at Hall B3, Stand #481, will see firsthand the company’s DI solder mask for curtain coat applications—another example of Sun Chemical’s ongoing development of the Imagecure product range to meet the continually changing demands of the printed circuit board industry, along with all of Sun Chemical’s existing and new products for the PCB, PE and PV markets.
For more information, visit www.sunchemical.com or visit Sun Chemical at Hall B3/Stand 481 at productronica 2019 in Munich, Germany.
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07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits
07/08/2025 | Article by Maria Cuesta Martin, Victor Martinez, Vidal Gonzalez Aguado, Würth ElektronikInherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. The cabinets serve to shield certain components from electromagnetic interference (EMI). However, these cavities present some resonance peaks at 5 GHz, making it impossible to use them at higher frequencies.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
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