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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Webinar to Review iNEMI Survey Results on Coupling PICs
October 25, 2019 | iNEMIEstimated reading time: Less than a minute
iNEMI will be holding a webinar to review the results of the recent iNEMI survey on edge vs. vertical coupling to photonic integrated circuits (PICs) and discuss the development of a demonstrator module. The survey was conducted as part of the ongoing Board-Level Optical Interconnect project, a collaborative effort between iNEMI and IPSR-I (Integrated Photonics Systems Roadmap-International).
The responses helped identify which design and performance attributes are of greatest importance to PIC manufacturers and users. This webinar will summarize the inputs received from across the supply chain, and the results of the survey will be incorporated into the design specifications of an optical demonstrator module which the team is considering assembling in the next 24-month period.
This webinar is open to members and non-members. It is scheduled on Wednesday, October 30, from 11:00 a.m. to 12:00 p.m. EDT.
To register, click here.
Suggested Items
Rules of Thumb: Design007 Magazine, November 2024
11/11/2024 | I-Connect007 Editorial TeamRules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. They’re built on design formulas, fabricators’ limitations, and tribal knowledge. And unfortunately, some longtime rules of thumb should be avoided at all costs. How do we separate the wheat from the chaff, so to speak?
Connect the Dots: Best Practices for Prototyping
09/21/2023 | Matt Stevenson -- Column: Connect the DotsPCB prototyping is a critical juncture during an electronic device’s journey from concept to reality. Regardless of a project’s complexity, the process of transforming a design into a working board is often enlightening in terms of how a design can be improved before a PCB is ready for full production.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Asia/Pacific AI Spending Surge to Reach a Projected $78 Billion by 2027
09/19/2023 | IDCAsia/Pacific spending on Artificial Intelligence (AI) ), including software, services, and hardware for AI-centric systems will grow to $78.4 billion in 2027, according to International Data Corporation's latest Worldwide Artificial Intelligence Spending Guide.
Intel to Sell Minority Stake in IMS Nanofabrication Business to TSMC
09/13/2023 | IntelIntel Corporation announced that it has agreed to sell an approximately 10% stake in the IMS Nanofabrication business to TSMC. TSMC’s investment values IMS at approximately $4.3 billion, consistent with the valuation of the recent stake sale to Bain Capital Special Situations.