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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Mentor On-Demand Webinar: Perfecting Your PCB with DFM Analysis
October 28, 2019 | Mentor, a Siemens businessEstimated reading time: 1 minute
Historically, design-for-manufacturability (DFM) checks have taken place during the fabrication process and have typically been performed by PCB manufacturing engineers or fab houses utilizing DFM-specific analysis software. The typical PCB designer would only run their own built-in pre-fabrication DRC and integrity checks prior to sending out for manufacturing and wait to hear from the fabricator if issues were encountered.
Today, DFM analysis allows designers to identify and correct potential fabrication and assembly issues in the design database before they hit the production floor. Without DFM, you leave changes in the manufacturer’s hands, where the focus is on increasing yield, not on the electrical performance of the final product.
In this on-demand webinar, presenters Shivani Joshi and John McMillan with Mentor, a Siemens business, will explain how PADS Professional can empower you to eliminate costly manufacturing delays by minimizing supplier call-backs and design re-spins.
What Attendees Will Learn
- Common DFM issues that cause delays in fabrication
- Common DFA issues that cause delays in assembly
- Panelization using PADS Professional's FabLink
- Producing an output file: ODB++ vs. Gerber
- Proper data to include in design for fabrication and assembly
Who Should Attend
- Engineering managers
- Electrical and hardware engineers
- PCB designers
For more information or to register, click here.
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