Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
RS Components Launches Professional Upgrade to Free PCB Design Tool in N.A.
October 31, 2019 | GlobeNewswireEstimated reading time: 1 minute
In conjunction with the official launch of its DesignSpark online engineering and design community in North America, RS Components (RS), a global multi-channel provider of industrial and electronic products and solutions, is debuting DesignSpark PCB Pro, a professional-level upgrade to its already popular free online PCB design tool, DesignSpark PCB.
DesignSpark PCB is an award-winning, free-to-use electronic computer-assisted design (ECAD) rapid prototyping tool offering workflow integration; unlimited schematic size, sheets, nodes, pads and connections; part library integration; unrestricted Gerber and ODB++ file output; multi-format bill of material generation; and compatibility with all other DesignSpark CAD systems.
In addition to the features available in the free tool, DesignSpark PCB Pro is specifically designed to bridge the gap between existing complex, high-cost, PCB design software and low-end, unsupported open-source tools for professional design engineers. The software provides an upgraded design suite, along with a wealth of productivity features to accelerate and enhance the design process, including blind and buried vias, extensive copper pour rules, hierarchical blocks, net class-level spacing rules, and manufacturability checks. An upgraded autorouter optimizes the efficiency of the board layout, while enhanced library support allows import of the latest symbols, footprints and 3D models. DesignSpark PCB Pro is now available for users in North America for just $449 for a perpetual license.
"With the addition of DesignSpark PCB Pro, RS Components is excited to add yet another cost-effective, easy-to-use professional tool to the resources available through our 850,000 member-strong DesignSpark online engineering community," said Cameron Ward, senior vice president of RS Components. "We remain committed to finding new ways to enable and partner with electronics designers, engineers and buyers across the entire product lifecycle."
Both DesignSpark PCB and DesignSpark PCB Pro are part of the suite of tools and resources available through DesignSpark, RS Components' free online engineering community that joins together more than 100,000 active members in North America, and more than 850,000 globally to solve companies' toughest engineering design challenges. The fast-growing platform, which added almost 130,000 worldwide users in 2019, provides resources, connections, tools and online purchasing for engineers throughout the product lifecycle.
Find out how RS Components can help make your technology vision a reality by joining the DesignSpark community, and by connecting with them on Twitter, LinkedIn, Facebook or Instagram.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.