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Miva Technologies and MivaTek Global to Exhibit at Productronica 2019
October 31, 2019 | MivaTek GlobalEstimated reading time: Less than a minute
Miva Technologies and their partner MivaTek Global look forward to interacting with attendees at Productronica 2019 at the Messe Munchen Trade Exhibition in Munich, Germany, November 12-15. The company will be showcasing their 2400DT Dual Tray LED Direct Imaging System. This system is equipped with 6 x 25 micron light engines, making the unit ideal for high throughput for imaging inner and outer layer dry film and solder mask panels.
Chris Hrusovsky, MivaTek Global’s vice president of business development, commented, “Many of the larger global PCB manufacturers are seeking a cost affordable direct imaging system with state-of-the-art imaging quality and high panel capacities. There is also a strong desire to coordinate the DI machines with automation. At Productronica, we will be able to showcase this with our 2400DT machine and a number of automation systems.” Hrusovsky also added, “MivaTek Global continues to grow our North American PCB customer base, recently receiving our 42nd Direct Imager order, a 2000L System, from a PCB manufacturer in Ohio. This sale was completed with our partner Allen Woods.”
Visit Miva Technologies and MivaTek Global on the show floor in Hall B3, Stand 436.
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
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Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
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