Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
The Changing Landscape
October 31, 2019 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
As I write this column, I’m in Chicago, wrapping up our coverage of SMTA International 2019 with other members of the I-Connect007 team; it was a productive, news-rich show. We’ll be bringing you video and written interviews, articles, and—when the publication moratorium is lifted—some of the most impactful technical papers presented at the SMTAI technical conference sessions.
I couldn’t help but be continuously reminded at SMTAI of the theme for this issue. Our theme is “Landscape of the Industry” with the implication that it’s changing, which certainly fits the current state of our market. Factory automation continues to move forward. New developments are being introduced, which are based upon improved AI and data analysis (as opposed to simply capturing the data). And multiple tiers of equipment suppliers are introducing capital equipment and add-ons to enable Industry 4.0 for (nearly) everyone.
SMTAI featured two keynote speakers: Adam Steltzner, a NASA Jet Propulsion Laboratory (JPL) engineer who led the Mars Science Laboratory's Entry, Descent, and Landing (EDL) Phase for the Curiosity rover and the chief engineer for the Mars 2020 Project; and Dr. Mike Hawes, Lockheed Martin Vice President for Human Space Exploration and Orion Program Manager. The energy at both keynotes was palpable. We’re returning to extra-orbital space with human crews, and the demands of such missions drive innovation.
However, human factors in our industry are changing; as the “gray tsunami” of retirements begin to deplete the industry’s hard-won wisdom in printed circuit fabrication and assembly, our work will need to be done in a different way. New technology and product R&D is being driven by emerging applications (e.g., automotive, medical, and the return to space), and new applications are being enabled by leading-edge technologies. Together, these dynamics create an upward spiral and a wider view of how innovation can change our world.
This issue launches a multi-month, thoughtful look at our industry across all of our magazines.
To read this column, which appeared in the October 2019 issue of SMT007 Magazine, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.