-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Sign up Now for the SMTA Oregon Chapter Meeting Nov. 21
November 5, 2019 | SMTA Oregon ChapterEstimated reading time: 1 minute
The Oregon Chapter of the SMTA will meet at Axiom Electronics on November 21 from 4-7 pm for a presentation by Dale Lee of Plexus.
His discussion is titled “Tolerance Mistaken: Impacts of not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations.”
Presentation Highlights
Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume. The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces. However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products.
This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.
About the Speaker
Dale Lee is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields. Dale has been involved in surface mount design, package and process development and production for over 30 years in various technical and managerial positions.
Date
November 21, 2019
Time
4-7 pm
Place
Axiom Electronics
9845 NE Eckert Drive Suite 200
Hillsboro, Oregon 97006
To RSVP for this event, click here.
Suggested Items
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A