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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Zuken Innovation World Posts Call for Papers
November 13, 2019 | ZukenEstimated reading time: Less than a minute
Zuken is now accepting abstracts for the annual conference, ZIW, which will be held April 27–30 in Coronado, California.
The technical conference will include three tracks focused on:
- Digital Engineering initiatives and best practices including model-based design and the digital thread
- Electronic System Design that includes architecture optimization, SI/PI/EMC, ECAD/MCAD co-design and IC packaging
- Electrical System Design including wire harness and panel for the transportation, power, special vehicles, aerospace and defense industries
Presentations are 45 minutes in length. We welcome individuals and teams to submit papers for consideration.
For more information, visit www.zuken.com.
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