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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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Zuken Innovation World Posts Call for Papers
November 13, 2019 | ZukenEstimated reading time: Less than a minute
Zuken is now accepting abstracts for the annual conference, ZIW, which will be held April 27–30 in Coronado, California.
The technical conference will include three tracks focused on:
- Digital Engineering initiatives and best practices including model-based design and the digital thread
- Electronic System Design that includes architecture optimization, SI/PI/EMC, ECAD/MCAD co-design and IC packaging
- Electrical System Design including wire harness and panel for the transportation, power, special vehicles, aerospace and defense industries
Presentations are 45 minutes in length. We welcome individuals and teams to submit papers for consideration.
For more information, visit www.zuken.com.
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