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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Zuken Innovation World Posts Call for PapersNovember 13, 2019 | Zuken
Estimated reading time: Less than a minute
Zuken is now accepting abstracts for the annual conference, ZIW, which will be held April 27–30 in Coronado, California.
The technical conference will include three tracks focused on:
- Digital Engineering initiatives and best practices including model-based design and the digital thread
- Electronic System Design that includes architecture optimization, SI/PI/EMC, ECAD/MCAD co-design and IC packaging
- Electrical System Design including wire harness and panel for the transportation, power, special vehicles, aerospace and defense industries
Presentations are 45 minutes in length. We welcome individuals and teams to submit papers for consideration.
For more information, visit www.zuken.com.
Further to the announcement of 17 August 2023, BAE Systems has now received the necessary regulatory approvals and will be executing steps in the coming days to complete the acquisition of Ball Aerospace from Ball Corporation.
With such an extremely newsy week, it was hard to select just five items you absolutely must read, but here goes. We have advocacy news from PCBAA and IPC, global market data on AI PC and GenAI smartphone hardware, a roundtable discussion on sales and marketing, a bookended pair of international milaero stories emphasizing a healthy aerospace industry, and an industry report on global semiconductor sales.
Honeywell announced it will invest $84 million to expand its Olathe manufacturing facility in Kansas. The project, which is expected to generate nearly $47 million in total gross domestic product (GDP) and contribute $18.3 million to state and local taxes in the first six years, supports the company's alignment with the compelling megatrend of the future of aviation.
Ventec International Group Co., Ltd. is pleased to announce that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) Printed Circuit Boards.
NEOTech Grows Industry Lead and Unmatched Expertise in Microelectronics for Aerospace & Defense Applications01/29/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is thrilled to announce the expansion of its state-of-the-art manufacturing center for Microelectronics as the need for reliable and complex Micro-E circuits continues to grow.