-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Europe Celebrates 16,000 Installed Systems
November 25, 2019 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview, Editor Nolan Johnson and Harald Eppinger, managing director at Koh Young Europe, discuss the company’s milestone of 16,000 installed systems, the Zenith Alpha, and market trends in AOI systems.
This year at productronica, Koh Young proudly introduced the True 3D AOI platform—Zenith Alpha. Leveraging its award-winning technologies, the Zenith Alpha fits myriad applications and manufacturers of all sizes. It incorporates a “smart and dynamic” feature set with AI-powered quality optimization True 3D technologies. This new system concentrates the technological insight to increase process performance and reduce line downtime. At the same time, its inherent True 3D inspection capabilities help manufacturers methodically collect, analyze, and manage data in real-time to dynamically formulate a multifaced view of the assembly process.
Watch video below:
Suggested Items
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
OSI Systems Receives $36 Million Contract for Aviation Security Systems
05/08/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received a contract award for approximately $36 million to deploy and service airport screening solutions for a prominent international airport in the Middle East.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
Lockheed Martin Completes Orion Development for Artemis II Moon Mission
05/05/2025 | Lockheed MartinLockheed Martin has completed assembly and testing of NASA's Orion Artemis II spacecraft, transferring possession to NASA's Exploration Ground Systems (EGS) team.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in