-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Conductivity Laminate for High-frequency Applications
December 4, 2019 | Pete Starkey, I-Connect007Estimated reading time: Less than a minute
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Vitali Judin, area sales director with Rogers Corporation.
Editor Pete Starkey and Vitali Judin discuss how the company has responded to demands for high thermal conductivity combined with low loss in high-power RF applications with the newly launched. The PTFE-based TC350 Plus is capable of handling temperatures above 125°C and draws upon Rogers’ long experience with the TC350 material line-up. Vitali explains that processability is greatly improved with TC350, and that many design groups have been waiting for a material like this for some time.
The productronica event is one of the world’s leading trade fairs for electronics development and production. The productronica trade fair is held on alternating years, at the Messe München in Munich, Germany. The next productronica will be held November 16-19, 2021.
Watch video below:
Suggested Items
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
Global Citizenship: What I’ve Learned About the American PCB Business
11/20/2024 | Tom Yang -- Column: Global CitizenshipNavigating the complexities of the American PCB business has been an eye-opening experience. During my time in America, I have become more familiar with the American PCB business and doing business here. If I may, and with your indulgence, I would like to share my humble impressions of the American PCB industry and the American way of doing business, which I find interesting and admirable.
Spirit Announces Purchase Agreement with Tex Tech Industries for Intended Sale of FMI
11/19/2024 | Spirit AeroSystems, Inc.Spirit AeroSystems Holdings, Inc. announces a purchase agreement to sell Fiber Materials, Inc (FMI) business based in Biddeford, Maine, and Woonsocket, Rhode Island, to Tex-Tech Industries, Inc. for $165,000,000 in cash, subject to customary adjustment.