Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
Conductivity Laminate for High-frequency Applications
December 4, 2019 | Pete Starkey, I-Connect007Estimated reading time: Less than a minute
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Vitali Judin, area sales director with Rogers Corporation.
Editor Pete Starkey and Vitali Judin discuss how the company has responded to demands for high thermal conductivity combined with low loss in high-power RF applications with the newly launched. The PTFE-based TC350 Plus is capable of handling temperatures above 125°C and draws upon Rogers’ long experience with the TC350 material line-up. Vitali explains that processability is greatly improved with TC350, and that many design groups have been waiting for a material like this for some time.
The productronica event is one of the world’s leading trade fairs for electronics development and production. The productronica trade fair is held on alternating years, at the Messe München in Munich, Germany. The next productronica will be held November 16-19, 2021.
Watch video below:
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronics SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.