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Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Conductivity Laminate for High-frequency Applications
December 4, 2019 | Pete Starkey, I-Connect007Estimated reading time: Less than a minute
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Vitali Judin, area sales director with Rogers Corporation.
Editor Pete Starkey and Vitali Judin discuss how the company has responded to demands for high thermal conductivity combined with low loss in high-power RF applications with the newly launched. The PTFE-based TC350 Plus is capable of handling temperatures above 125°C and draws upon Rogers’ long experience with the TC350 material line-up. Vitali explains that processability is greatly improved with TC350, and that many design groups have been waiting for a material like this for some time.
The productronica event is one of the world’s leading trade fairs for electronics development and production. The productronica trade fair is held on alternating years, at the Messe München in Munich, Germany. The next productronica will be held November 16-19, 2021.
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