-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
The Future of the World Is Truly in the Hands of Our Youth
December 13, 2019 | Barry Matties, I-Connect007Estimated reading time: 1 minute
The investments we make in our youth now will pay off for generations to come. We have to support and help wherever we can. At I-Connect007, we are proud to once again sponsor the STEM Outreach Program at the upcoming IPC APEX EXPO 2020. This year, IPC plans to double the number of participating students to 200. It should be a great event.
Another way we support our youth at I-Connect007 is by sharing the stories of young people who are doing amazing things. The following interview tells the story of 14-year-old Dylan Nguyen. Dylan is an avid kite flier in the master class and is often a featured flier at kite festivals along with his younger brother, Cardin, who is age 12.
Dylan started kite flying about four years ago. Now, he and his family can be found participating in and volunteering at kite events. Dylan also believes in giving back to the community. For example, he learned to sew beautiful, handcrafted delta kites so that he could give them away to kids at the 2019 Washington State International Kite Festival. During the same festival, he also co-organized an event to set a new world record with stack kites.
Dylan is also a great student, musician, and creative thinker. Recently, he shared with me the details of his school science fair project, “Kite: Powering the Future,” which solved a problem that he faced. Dylan is a leader with a bright future, and the world is lucky to have him and other kids like him.
Barry Matties: Dylan, tell us about your recent STEM project.
Dylan Nguyen: At the 2018 Washington State International Kite Festival, I streamed music all day while flying. The issue was that I often found my phone running low on battery and had to go on long walks to the sound tent to recharge it. Then, I remembered a scene from the movie “Big Hero Six,” where a little turbine flies in the air. I thought, “That’s aerial energy!” Later, I read an article about a large part of Africa and India that does not have electricity but does have a lot of wind. I thought, “What if I build an airborne wind energy system tethered to a kite to convert wind energy into electrical energy?”
To read this entire interview, which appeared in the November 2019 issue of SMT007 Magazine, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.